Trymax NEO 3400 Series

The NEO3400 series is one of the latest addition to the industry leading NEO range of advanced plasma ashing and etching products from Trymax Semiconductor

It is ready for the higest volume of production adaptable to every production ramp and budget. The NEO 3000 systems can be configured with any of the current available Trymax NEO process modules and is compatible with substrates up to 300mm in diameter. The small footprint and modular design can be flexible configured based on your need.

• Features
- Up to 300 mm wafer size/substrate size
- 3 or 4 SMIF Loaders
- 4 axis dual arm robot handling with traverser
- 2 or 4 process chambers.
- 4 different process chamber technologies:
   • Microwave downstream (2.45 GHz)
   • RF bias (13.56MHz)
   • Dual Source (Microwave, RF bias)
   • DCP (RF Bias, Direct coupling plasma)
- Excellent uniformity and repeatability
- Mechanical throughput > 300wph
- Compact footprint
- Very low Cost of ownership
- Fully digital controlled, Devicenet-Ethernet
- Windows based industrial computers

• Applications
- Bulk resist strip
- Descum processing
- Polymer removal
- Post high dose implant strip
- Silicon Nitride etch applications
- MEMS applications
- Backend packaging processing (PR, PI, BCB, PBO)

• Compliance
- SEMI S2-01
- SEMI S8-01
- CE EU-RoHs

• Download specification Trymax NEO 3400 Series >
• Contact us for more information >