Trymax NEO 300A Series

The NEO300A series platform is one of the latest addition to the industry leading NEO range of advanced plasma ashing and etching products from Trymax Semiconductor Equipment.

It is a fully automated single chamber system that can be configured with any of the current available Trymax NEO process modules and is compatible with substrates up to 300mm in diameter. The small footprint NEO300A is configured with single

• Features
- Up to 300 mm wafer size/substrate size
- Bridge tool capability 200-300mm
- Single SMIF Loadport
- 3 axis dual arm robot handling
- Choice of 4 different process modules:
   • Microwave downstream (2.45 GHz)
   • RF bias (13.56MHz)
   • Dual Source (Microwave, RF bias)
   • DCP (RF Bias, Direct coupling plasma)
- Excellent uniformity and repeatability
- Mechanical throughput > 100wph
- Compact footprint
- Very low Cost of ownership
- Fully digital controlled, Devicenet-Ethernet
- Windows based industrial computer

• Applications
- Bulk resist strip
- Descum processing
- Polymer removal
- Post high dose implant strip
- Silicon Nitride etch applications
- MEMS applications
- Backend packaging processing (PR, PI, BCB, PBO)

• Compliance
- SEMI S2-01
- SEMI S8-01
- CE
- EU-RoHs

• Download specification Trymax NEO 300A Series >
• Contact us for more information >