Equipment

NEO3000 series

The Neo3000 series advanced plasma ashing/etch system from Trymax Semiconductor Equipment is the latest photoresist removal equipment offering exceptional performance at an incredible price. Specifically designed for applications up to 300 mm substrates.

It’s equipped with a ultra fast transfer platform flexible and configurable for handling all different dimensions of substrates between 200 and 300 mm.

The NEO3000 series has integrated all the demands from device manufacturers- compact design, high throughput to deliver the lowest cost of Ownership (CoO).

Features

200-300 mm wafer size/substrate size
2 or 3 SMIF’s.
5 axis dual arm vacuum or edge gripper transfer robot (customized wafer gripper)
3 different process modules:
- Microwave downstream (2,45GHz)
- RF bias isotropic (13,56MHz)
- Dual source microwave 2,45GHz, RF bias 13,56MHz
Excellent uniformity and repeatability
Mechanical throughput of > 230 WPH
Compact footprint
Very low Cost of ownership
Fully digital controlled, Device net – Ethernet
Single industrial computer with Windows XP Pro operating system
EU-RoHS Compliant

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Semicon China 2012