Trymax NEO 3000 Series

 
The NEO3000 product line is one of the latest addition to the industry leading NEO range of advanced plasma ashing and etching products from Trymax Semiconductor Equipment.

It is ready for the higest volume of production adaptable to every production ramp and budget. The NEO 3000 systems can be configured with any of the current available Trymax NEO process modules and is compatible with substrates up to 300mm or 330mm in diameter. The small footprint and modular design can be flexible configured based on your need.

• Features
- Up to 300 mm wafer size/substrate size
- 2 or 3 SMIF Loaders
- 5 axis dual arm robot handling
- Choice of 4 different process modules:
   • Microwave downstream (2.45 GHz)
   • RF bias (13.56MHz)
   • Dual Source (Microwave, RF bias)
   • DCP (RF Bias, Direct coupling plasma)
- Excellent uniformity and repeatability
- Mechanical throughput > 220wph
- Compact footprint
- Very low Cost of ownership
- Fully digital controlled, Devicenet-Ethernet
- Windows based industrial computer

• Applications
- Bulk resist strip
- Descum processing
- Polymer removal
- Post high dose implant strip
- Silicon Nitride etch applications
- MEMS applications
- Backend packaging processing (PR, PI, BCB, PBO)

• Compliance
- SEMI S2-01
- SEMI S8-01
- CE EU-RoHs

• Download specification Trymax NEO 3000 Series >
• Contact us for more information >