Trymax NEO 2400 Series

 
The NEO2400 series is one of the latest addition to the industry leading NEO range of advanced plasma ashing and etching products from Trymax Semiconductor Equipment.
 
The NEO 2400 systems can be configured with any of the current available process modules and is compatible with substrates up to 200mm in diameter.

• Features
- Up to 200mm wafer size/substrate size
- 4 integrated SMIF indexers or 4 open cassette stations
- 4 axis dual arm robot handling with traverser
- Optional coolingstation and notch aligner
- 2 or 4 process chambers
- 4 different process chamber technologies:
  • Microwave downstream (2.45 GHz)
  • RF bias (13.56 MHz)
  • Dual Source (Microwave, RF bias)
  • DCP (RF bias, direct coupling plasma)
- Excellent uniformity and repeatability
- Mechanical throughput > 300wph
- Compact footprint
- Very low Cost of ownership
- Fully digital controlled Devicenet, Ethernet
- Windows based industrial computers

• Applications
- Bulk resist strip
- Descum processing
- Polymer removal
- Post high dose implant strip
- Silicon Nitride etch applications
- MEMS applications
- Advanced packaging processing (PR, PI, BCB, PBO)

• Compliance
- SEMI S2-01
- SEMI S8-01
- CE EU-RoHs

Download specification Trymax NEO 2400 Series >
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