Trymax NEO 200A Series

 
The NEO200A series platform is the latest addition to the industry leading NEO range of advanced ashing and etching products from Trymax Semiconductor Equipment.

It is a fully automated single chamber system that can be configured with any of the currently available Trymax NEO process modules and is compatible with substrates up to 200mm in diameter. The small footprint NEO200A is configured with dual cassette.

• Features
- Up to 200 mm wafer size/substrate size
- Dual cassette platform
- 3 axis dual arm robot handling
- Choice of 4 different process modules:
   • Microwave downstream (2.45 GHz)
   • RF bias (13.56MHz)
   • Dual Source (Microwave, RF bias)
   • DCP (RF Bias, Direct coupling plasma)
- Excellent uniformity and repeatability
- Mechanical throughput > 100wph
- Compact footprint
- Very low Cost of ownership
- Fully digital controlled, Devicenet-Ethernet
- Windows based industrial computer

• Applications
- Bulk resist strip
- Descum processing
- Polymer removal
- Post high dose implant strip
- Silicon Nitride etch applications
- MEMS applications
- Backend packaging processing (PR, PI, BCB, PBO)

• Compliance
- SEMI S2-01
- SEMI S8-01
- CE
- EU-RoHs

• Download specification Trymax NEO 200A Series >
• Contact us for more information >